According to Tonawanda, N.Y.-based Wendt Corp., Wendt/TITECH has improved the capabilities of its metal detection software. The company says that its SUPPIXX metal-detection sensors are now more advanced and generate high resolution digital mapping of shapes and images of each particle. Wendt’s SUPPIXX-image processing is designed to offer precise targeting and ejection, while running at full sensitivity with minimal waste.
The focus of the new Finder III software is targeted at enhancing product quality by separating the recovered metals. The Finder III technology can create an upgraded Zurik product while suppressing circuit boards. Using its enhanced shape recognition capabilities for sorting, a dedicated wire product can be created by extracting the bare, black and insulated copper wires, according to Wendt.
Finder III technology is also available as an upgrade on all existing Wendt/TITECH Finders. More information is available at www.wendtcorp.com.
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