Dynamic Lifecycle Innovations opens new processing facility

Dynamic Lifecycle Innovations, Wisconsin, has announced that it has expanded its corporate headquarters location with the opening of a new 140,000-square-foot materials processing and recovery facility. This addition brings the company’s footprint at its Wisconsin campus to a total of 390,000 square feet.

The full-service electronics and materials life cycle management corporation made the announcement at the E-Scrap Conference in New Orleans.

In a press release, the corporation says the new facility expands its processing capabilities for complex materials, such as electronic, precious metal, nonferrous and nonmetal materials. Customers can benefit from customized plans for their hard-to-recycle items that offer maximum recovery and increased risk management, ensuring materials are processed safely, securely and sustainably, Dynamic says.

“We are thrilled to offer our clients world-class expanded products and services across a broader spectrum of materials, with highly competitive pricing,” says Miles Harter, Dynamic Lifecycle Innovations CEO. “We’re committed to safeguarding our customers and the environment, and this new facility allows us to deliver even greater processing capabilities with a vendor they know they can trust. It’s even more exciting to deliver on this promise as a direct result of our own team members’ dedication to continuous innovation.”

Jason Schott, vice president of sales at Dynamic Lifecycle Innovations, highlights that Dynamic’s new processing and recovery facility offers customers worldwide greater assurance of brand and risk management, as well as several new service offerings.

“By processing more types of complex materials domestically, we can limit our clients’ exposure to the dangers associated with exporting,” he says. “Additionally, enhanced processing capabilities across a broad spectrum of materials allow us to offer customers innovative services, including solar processing, consumer returns and certified destruction.”