The 5th International Molded Pulp Packaging Seminar will be held in Milwaukee, Wis., Sept. 25-26. The seminar will feature the first U.S. exposure of the latest high volume "Thermoformed Pulp" manufacturing machine, as well as three speakers from China describing molded pulp packaging activity in Asia.
Other speakers will deal with current international environmental initiatives and molded pulp user case studies.
More information on attending the conference may be obtained by contacting IMPEPA at 262-241-0522 or e-mailing grygny@execpc.com.
Explore the June 2000 Issue
Check out more from this issue and find your next story to read.
Latest from Recycling Today
- Cards Recycling, Live Oak Environmental merge to form Ecowaste
- Indiana awards $500K in recycling grants
- Atlantic Alumina partners with US government on alumina, gallium production
- GP Recycling president retires
- Novelis Latchford commissions new bag houses
- UK facility focuses on magnet recycling
- Aduro revenue increases while losses widen
- Worldsteel updates its indirect steel data
