The 5th International Molded Pulp Packaging Seminar will be held in Milwaukee, Wis., Sept. 25-26. The seminar will feature the first U.S. exposure of the latest high volume "Thermoformed Pulp" manufacturing machine, as well as three speakers from China describing molded pulp packaging activity in Asia.
Other speakers will deal with current international environmental initiatives and molded pulp user case studies.
More information on attending the conference may be obtained by contacting IMPEPA at 262-241-0522 or e-mailing grygny@execpc.com.
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